DIP Processing

Company Name: Trois Electronics (WUXI) Co., Ltd.

•DIP production line: 1 line

•Types of boards: Single-sided, double-sided, FPC boards, aluminum boards

•Component specifications: Maximum height of soldered components within 10cm

•PCB specifications: Bare boards: 5cm≦45cm, boards ≤5cm can be completed with tray fixtures for DIP soldering

 

Advantages:

1.  Rosin furnace for selective spraying

(1)Rosin Saving 

(2)Low fixture cleaning

2.Dual temperature zones (upper and lower zones)

Comes with an upper temperature zone, which is beneficial for products with high tin requirements on through-holes

3.Real-time display, convenient for setting and tracking the position of the substrate

4.Equipped with internal rosin spray device, serving as a rosin spray-soldering integrated machine, capable of replacing external rosin furnaces